The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 03, 2006
Takeshi Sakamoto, Hamamatsu, JP;
Kenichi Muramatsu, Hamamatsu, JP;
Takeshi Sakamoto, Hamamatsu, JP;
Kenichi Muramatsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrateis irradiated with laser light L from the multilayer partside while locating a converging point P within the substrate, so as to form a first modified regionshifted from the center position CL in the thickness direction of the substrateto the rear faceside of the substrateand a second modified regionshifted from the center position CL in the thickness direction of the substrateto the front faceside of the substratewithin the substratealong a line to cut, and generate a fracturefrom the second modified regionto the front faceof the substrate. Thereafter, while in a state where an expandable tapeattached to the rear faceof the substrateis expanded, a stress is generated in an object to be processedsuch as to open the fracture