The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Nov. 16, 2005
Tatsushi Sato, Tokyo, JP;
Yoshihito Imai, Tokyo, JP;
Teiji Takahashi, Tokyo, JP;
Takeshi Sakata, Tokyo, JP;
Tomoko Sendai, Tokyo, JP;
Yoichiro Nishimoto, Tokyo, JP;
Shigeru Matsuno, Tokyo, JP;
Takeyuki Maegawa, Tokyo, JP;
Takaaki Iwata, Tokyo, JP;
Tatsushi Sato, Tokyo, JP;
Yoshihito Imai, Tokyo, JP;
Teiji Takahashi, Tokyo, JP;
Takeshi Sakata, Tokyo, JP;
Tomoko Sendai, Tokyo, JP;
Yoichiro Nishimoto, Tokyo, JP;
Shigeru Matsuno, Tokyo, JP;
Takeyuki Maegawa, Tokyo, JP;
Takaaki Iwata, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 Ω·cm and equal to or lower than 5 Ω·cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 μsec and equal to or lower than 4 μsec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.