The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Nov. 18, 2005
Mitsuhiro Watanabe, Yokosuka, JP;
Kinji Saijo, Kudamatsu, JP;
Shinji Ohsawa, Kudamatsu, JP;
Kazuo Yoshida, Kudamatsu, JP;
Koji Nanbu, Kudamatsu, JP;
Mitsuhiro Watanabe, Yokosuka, JP;
Kinji Saijo, Kudamatsu, JP;
Shinji Ohsawa, Kudamatsu, JP;
Kazuo Yoshida, Kudamatsu, JP;
Koji Nanbu, Kudamatsu, JP;
Toyo Kohan Co., Ltd., Tokyo, JP;
Abstract
A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized.