The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 30, 2009
Se-ho Park, Suwon-si, KR;
Ki-hyun Kim, Suwon-si, KR;
Seok-myong Kang, Yongin-si, KR;
Young-min Lee, Yongin-si, KR;
Se-Ho Park, Suwon-si, KR;
Ki-Hyun Kim, Suwon-si, KR;
Seok-Myong Kang, Yongin-si, KR;
Young-Min Lee, Yongin-si, KR;
Samsung Electronics Co., Ltd, , KR;
Abstract
A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.