The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jun. 04, 2010
Michiaki Sugiyama, Kanagawa, JP;
Takashi Miwa, Kanagawa, JP;
Toshikazu Ishikawa, Kanagawa, JP;
Tatsuya Hirai, Kanagawa, JP;
Michiaki Sugiyama, Kanagawa, JP;
Takashi Miwa, Kanagawa, JP;
Toshikazu Ishikawa, Kanagawa, JP;
Tatsuya Hirai, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A first conductive member made of metal is provided over a first wiring substrate, which is a mounting substrate in the lower tier, a through hole is provided in a second wiring substrate, which is a mounting substrate in the upper tier, at a position corresponding to the first conductive member in a plan view, and a wiring is exposed at the sidewall of the through hole. The first conductive member is inserted into the through hole on the corresponding first wiring substrate side and the first wiring substrate and the second wiring substrate are electrically coupled by filling the through hole with a second conductive member. an electrode pad that is electrically coupled to the second conductive member and over which a semiconductor member in the upper tier is mounted is formed on the main surface side of the second wiring substrate.