The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 31, 2006
Tadashi Endo, Fukuoka, JP;
Akira Noudo, Fukuoka, JP;
Takeyuki Kawase, Saga, JP;
Osamu Okuda, Fukuoka, JP;
Hiroshi Ogata, Fukuoka, JP;
Tadashi Endo, Fukuoka, JP;
Akira Noudo, Fukuoka, JP;
Takeyuki Kawase, Saga, JP;
Osamu Okuda, Fukuoka, JP;
Hiroshi Ogata, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter () equipped with a transfer head () having a component-sucking-and-holding nozzle (), for transferring a component P and mounting the component P onto a board (), and includes: lowering the component P to within the high-accuracy range of a first line sensor () for measuring the height of the component P; and measuring the height of the component P using the first line sensor ().