The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8136066 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 13, 2012

Filed:

Dec. 01, 2008
Applicants:

Jeanne Paulette Spence Bickford, Essex Junction, VT (US);

Jason D. Hibbeler, Williston, VT (US);

Juergen Koehl, Weil Schoenbuch, DE;

William John Livingstone, Unerhill, VT (US);

Daniel Nelson Maynard, Craftsbury Common, VT (US);

Inventors:

Jeanne Paulette Spence Bickford, Essex Junction, VT (US);

Jason D. Hibbeler, Williston, VT (US);

Juergen Koehl, Weil Schoenbuch, DE;

William John Livingstone, Unerhill, VT (US);

Daniel Nelson Maynard, Craftsbury Common, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method, apparatus, system, and computer program product that performs yield estimates using critical area analysis on integrated circuits having redundant and non-redundant elements. The non-redundant elements are ignored or removed from the critical area analysis performed for undesired opens.


Find Patent Forward Citations

Bickford, Jeanne Paulette Spence. (2012). Apparatus and computer program product for semiconductor yield estimation (U.S. Patent No. 8136066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8136066

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