The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Nov. 21, 2008
Applicants:

Takashi Umemoto, Moriguchi, JP;

Hiroshi Nonoue, Moriguchi, JP;

Inventors:

Takashi Umemoto, Moriguchi, JP;

Hiroshi Nonoue, Moriguchi, JP;

Assignee:

Sanyo Electric Co., Ltd., Moriguchi, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 9/10 (2006.01); H01G 9/00 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

An aspect of the present invention provides a solid electrolytic capacitor that comprises: an anode mainly formed of a valve metal or an alloy thereof; an anode lead terminal a part of which is buried in a side surface of the anode; a dielectric layer formed on surfaces of the anode and mainly formed of an oxide; a conducting polymer layer formed on the dielectric layer; a cathode layer formed on the conducting polymer layer on an outer circumferential surface of the anode, the cathode layer comprising: a carbon layer; and a silver paste layer formed on the carbon layer; a thermal expansion layer provided on the side surface of the anode and on a part of the outer circumferential surface continuing from the side surface; and a rein outer package provided to cover the anode, dielectric layer, cathode layer, and thermal expansion layer, wherein a thermal expansion coefficient in a temperature range lower than a glass transition temperature of the thermal expansion layer is larger than that of each of the silver paste layer and the resin outer package.


Find Patent Forward Citations

Loading…