The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Sep. 11, 2009
Applicants:

Takao Nishimura, Kawasaki, JP;

Yoshiaki Narisawa, Kawasaki, JP;

Inventors:

Takao Nishimura, Kawasaki, JP;

Yoshiaki Narisawa, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substratehaving an electrodeA arranged on its surface; and a first semiconductor elementA which includes an electrodearranged on its surface and which is supported by the substrate, wherein a first wireis connected through a first bumpto at least one of the electrodes over the substrateand semiconductor elementA (i.e., at least one of the electrodesand), and a second wireis connected through a second bumpto a bonding portion of the wire


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