The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Jun. 23, 2009
Applicants:

Mikihiko Komatsu, Tokyo, JP;

Takao Hidaka, Tokyo, JP;

Junko Kimura, Tokyo, JP;

Inventors:

Mikihiko Komatsu, Tokyo, JP;

Takao Hidaka, Tokyo, JP;

Junko Kimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A voltage generated in any of a plurality of semiconductor chips is supplied to another chip as a power supply voltage to realize a stable operation of a semiconductor device in which the semiconductor chips are stacked in the same package. For example, two chips are stacked with each other, first to third pads are disposed along corresponding sides of the respective chips, which are arranged close and in parallel to each other, and these pads are commonly connected to each other with first to third metal wires respectively. In another example, fourth and fifth pad are disposed along a side different form a side along which the first to third pads are disposed, and further connected to each other with a fourth metal wire directly between the chips.


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