The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

Mar. 26, 2007
Applicants:

Toshiyuki Hiroi, Saitama, JP;

Akihiko Sugawara, Kanagawa, JP;

Inventors:

Toshiyuki Hiroi, Saitama, JP;

Akihiko Sugawara, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a processing apparatus, a plurality of processors which perform different kinds of processing is integrated on a first semiconductor substrate. A plurality of memories to be managed by the plurality of processors integrated on the first semiconductor substrate is integrated on a second semiconductor substrate. The plurality of processors integrated on the first semiconductor substrate includes respective separate memory controllers which control the memories to be managed that are integrated on the second semiconductor substrate. The semiconductor substrates are manufactured using different semiconductor manufacturing processes, and micro bumps are formed on their respective surfaces. The semiconductor substrates are stacked together in the thickness direction, and are connected to each other through the micro bumps.


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