The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2012
Filed:
Oct. 28, 2008
Sohei Samejima, Chiyoda-ku, JP;
Sadao Sato, Amagasaki, JP;
Tsuyoshi Ozaki, Chiyoda-ku, JP;
Hiroyuki Osuga, Chiyoda-ku, JP;
Teruhiko Kumada, Chiyoda-ku, JP;
Sohei Samejima, Chiyoda-ku, JP;
Sadao Sato, Amagasaki, JP;
Tsuyoshi Ozaki, Chiyoda-ku, JP;
Hiroyuki Osuga, Chiyoda-ku, JP;
Teruhiko Kumada, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.