The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8134084 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 13, 2012

Filed:

Jun. 27, 2007
Applicants:

Toshiyuki Kawaguchi, Tokyo, JP;

Kazutoki Tahara, Saitama, JP;

Tsutomu Saga, Saitama, JP;

Mitsuaki Negishi, Kitakatsushika-gun, JP;

Inventors:

Toshiyuki Kawaguchi, Tokyo, JP;

Kazutoki Tahara, Saitama, JP;

Tsutomu Saga, Saitama, JP;

Mitsuaki Negishi, Kitakatsushika-gun, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.


Find Patent Forward Citations

Kawaguchi, Toshiyuki. (2012). Noise-suppressing wiring-member and printed wiring board (U.S. Patent No. 8134084). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8134084

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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