The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2012

Filed:

May. 05, 2009
Applicants:

Steven M. Toller, Dublin, OH (US);

Jeff L. Dulaney, Dublin, OH (US);

Inventors:

Steven M. Toller, Dublin, OH (US);

Jeff L. Dulaney, Dublin, OH (US);

Assignee:

LSP Technologies, Inc., Dublin, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.


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