The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Oct. 07, 2008
Takahiro Mamiya, Aichi, JP;
Tsuyoshi Ohyama, Aichi, JP;
Takahiro Mamiya, Aichi, JP;
Tsuyoshi Ohyama, Aichi, JP;
CKD Corporation, Aichi, JP;
Abstract
An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates 'ideal solder position information' and 'ideal solder sizes' from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates “actual solder position information” from the actual solder regions. The image processing unit generates “position misalignment amounts” between the “ideal solder position information” and “actual solder position information,” generates “print misalignment rates” indicating the extents of the “position misalignment amounts” relative to the “ideal solder sizes,” calculates a correction value relating to print position based on the “print misalignment rates,” and outputs a correction value signal to the solder printing machine.