The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Nov. 28, 2008
Tohru Ohnishi, Mie, JP;
Hitoshi Kouno, Mie, JP;
Toshiyuki Taniguchi, Mie, JP;
Koji Nakashima, Mie, JP;
Toshiyuki Nakata, Mie, JP;
Tsunetsugu Imanishi, Mie, JP;
Keiichi Nakao, Osaka, JP;
Tohru Ohnishi, Mie, JP;
Hitoshi Kouno, Mie, JP;
Toshiyuki Taniguchi, Mie, JP;
Koji Nakashima, Mie, JP;
Toshiyuki Nakata, Mie, JP;
Tsunetsugu Imanishi, Mie, JP;
Keiichi Nakao, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.