The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Nov. 18, 2009
Yoshihiro Kondo, Tsuchiura, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Akio Idei, Hatano, JP;
Shigeyasu Tsubaki, Odawara, JP;
Hiroyuki Toyoda, Mito, JP;
Tomoo Hayashi, Hitachinaka, JP;
Yoshihiro Kondo, Tsuchiura, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Akio Idei, Hatano, JP;
Shigeyasu Tsubaki, Odawara, JP;
Hiroyuki Toyoda, Mito, JP;
Tomoo Hayashi, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.