The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Jul. 15, 2009
Chajea JO, Bucheon-si, KR;
Uihyoung Lee, Seoul, KR;
Jae-hyun Phee, Yongin-si, JP;
Jeong-woo Park, Suwon-si, KR;
Ha-young Yim, Seoul, KR;
Chajea Jo, Bucheon-si, KR;
Uihyoung Lee, Seoul, KR;
Jae-hyun Phee, Yongin-si, JP;
Jeong-Woo Park, Suwon-si, KR;
Ha-Young Yim, Seoul, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.