The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
May. 17, 2007
Fumitomo Takano, Tochigi, JP;
Shinya Watanabe, Tochigi, JP;
Tsukasa Aiba, Tochigi, JP;
Hiroshi Otsuka, Wako, JP;
Joji Nakashima, Tochigi, JP;
Fumitomo Takano, Tochigi, JP;
Shinya Watanabe, Tochigi, JP;
Tsukasa Aiba, Tochigi, JP;
Hiroshi Otsuka, Wako, JP;
Joji Nakashima, Tochigi, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device is composed of a pair of semiconductor chips () arranged parallel on the same flat plane; a high voltage bus bar () bonded on the surface on the collector side of one semiconductor chip (); a low voltage bus bar () connected to the surface on the emitter side of the other semiconductor chip () with a bonding wire (); a first metal wiring board (-) connected to the surface on the emitter side of the semiconductor chip () with a bonding wire (); a second metal wiring board (-) bonded on the surface on the collector side of the semiconductor chip (); a third metal wiring board (-) connected to the first metal wiring board (-); a fourth metal wiring board (-) connected by being bent from an end portion of the second metal wiring board (-); and an output bus bar () having output terminals () extending from each end portion of the third metal wiring board (-) and that of the fourth metal wiring board (-).