The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2012

Filed:

Oct. 29, 2009
Applicants:

Jin Bock Lee, Gyeonggi-do, KR;

Hee Seok Park, Gyeonggi-do, KR;

Hyung Kun Kim, Gyeonggi-do, KR;

Young Jin Lee, Seoul, KR;

Inventors:

Jin Bock Lee, Gyeonggi-do, KR;

Hee Seok Park, Gyeonggi-do, KR;

Hyung Kun Kim, Gyeonggi-do, KR;

Young Jin Lee, Seoul, KR;

Assignee:

Samsung LED Co., Ltd., Gyunggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 33/00 (2010.01); H01L 29/24 (2006.01); H01L 23/02 (2006.01); H01L 23/22 (2006.01); H01L 23/24 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.


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