The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Aug. 14, 2006
Tokuo Yoshida, Tenri, JP;
Akiyoshi Fujii, Nara, JP;
Tatsuya Fujita, Suzuka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
The multilayer wiring board is provided with a lower layer wiring (), and an upper layer wiring () formed on the lower layer wiring () through an interlayer insulating layer (). On the interlayer insulating layer (), a contact hole () is provided for interconnecting the upper layer wiring () with the lower layer wiring (). A region surrounded by an inner wall () which forms the contact hole () is permitted to have a linewidth region wherein a wide line region (A) and protruding regions (B,C) as regions having different linewidths are connected. Thus, film thickness distribution of an ink baked product () formed at the contact hole () rises at the protruding regions (B,C), and highly reliable multilayer interconnection can be performed between the lower layer wiring () and the upper layer wiring ().