The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8129609 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 06, 2012

Filed:

May. 13, 2009
Applicants:

Howard Hao Chen, Yorktown Heights, NY (US);

Richard C. Chu, Hopewell Junction, NY (US);

Louis L. Hsu, Fishkill, NY (US);

Inventors:

Howard Hao Chen, Yorktown Heights, NY (US);

Richard C. Chu, Hopewell Junction, NY (US);

Louis L. Hsu, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

Semiconductor integrated thermoelectric devices are provided, which are formed having high-density arrays of thermoelectric (TE) elements using semiconductor thin-film and VLSI (very large scale integration) fabrication processes. Thermoelectric devices can be either separately formed and bonded to semiconductor chips, or integrally formed within the non-active surface of semiconductor chips, for example.


Find Patent Forward Citations

Chen, Howard. (2012). Integrated thermoelectric cooling devices and methods for fabricating same (U.S. Patent No. 8129609). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8129609

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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