The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2012

Filed:

Jan. 26, 2005
Applicants:

Kazuhiko Ueda, Kobe, JP;

Hiroshi Iwakiri, Kobe, JP;

Inventors:

Kazuhiko Ueda, Kobe, JP;

Hiroshi Iwakiri, Kobe, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/00 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.


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