The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2012

Filed:

Oct. 29, 2004
Applicant:

Roy Knechtel, Geraberg, DE;

Inventor:

Roy Knechtel, Geraberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a process for and an arrangement of the connection of processed semiconductor wafers () wherein, in addition to the firm connection, there is an electric connection () between the semiconductor wafers and/or the electronic structures () supporting them. For this purpose, low-melting structured intermediate glass layers () are used as insulating layers and as an electric connection in the form of electrically conductive solder () on a glass basis in order to achieve a firm connection.


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Knechtel, Roy. (2012). Firm, insulating and electrically conducting connection of processed semiconductor wafers (U.S. Patent No. 8129255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8129255

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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