The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Sep. 14, 2006
Toshiaki Masuda, Yao, JP;
Ichiro Takahara, Yao, JP;
Kenichi Kitano, Yao, JP;
Katsushi Miki, Yao, JP;
Takeshi Inohara, Yao, JP;
Takayuki Aoki, Yao, JP;
Toshiaki Masuda, Yao, JP;
Ichiro Takahara, Yao, JP;
Kenichi Kitano, Yao, JP;
Katsushi Miki, Yao, JP;
Takeshi Inohara, Yao, JP;
Takayuki Aoki, Yao, JP;
Matsumoto Yushi-Seiyaku Co., Ltd., Yao-Shi, JP;
Abstract
Heat-expanded microspheres having high packing efficiency are produced by expanding heat-expandable microspheres, which include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.