The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8128395 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 06, 2012

Filed:

Nov. 12, 2009
Applicants:

Hiroyuki Shindo, Nagoya, JP;

Tomoki Nagae, Nagoya, JP;

Inventors:

Hiroyuki Shindo, Nagoya, JP;

Tomoki Nagae, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 47/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A honeycomb segment-forming die includes: an introducing portion provided on an introduction face side and having a plurality of back holes, and a forming portion provided on an formation face side and having slits communicating with the back holes. The forming portion has a polygonal outer peripheral shape and forms a prismatic honeycomb segment by passing kneaded clay for forming which is introduced from the back holes of the introducing portion through the slits of the forming portion, and a gap between slits formed in each of corner portions including a vertex of the polygonal forming portion is larger than a gap of slits formed in the central portion of the forming portion. This enables to form a honeycomb segment having high compressive strength.


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Shindo, Hiroyuki. (2012). Honeycomb segment-forming die and method for manufacturing honeycomb structure (U.S. Patent No. 8128395). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8128395

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