The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Apr. 01, 2009
David Grier, New York City, NY (US);
Eric Dufresne, Cambridge, MA (US);
David Grier, New York City, NY (US);
Eric Dufresne, Cambridge, MA (US);
The University of Chicago, Chicago, IL (US);
Abstract
A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts () and semiconductor pellets () onto each of wiring substrates () formed on a matrix substrate () after inspection. A defect mark () is affixed to a wiring substrate () as a block judged to be defective in the inspection of the matrix substrate (), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate () with the defect mark () thereon is omitted to attain the rationalization of a manufacturing line.