The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2012

Filed:

Mar. 29, 2007
Applicants:

Hidefumi Hatanaka, Kirishima, JP;

Kaoru Matsuo, Kirishima, JP;

Inventors:

Hidefumi Hatanaka, Kirishima, JP;

Kaoru Matsuo, Kirishima, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic componentwith a shielding function whose upper surface is held at a reference potential, an electronic component, and a semiconductor componentare mounted on a wiring board, and are covered with an insulating resin portionwhile a conductive layeris formed on an upper surface of the insulating resin portion. The conductive layeris held at the reference potential by being connected to a portion, which is held at the reference potential, of the electronic componentwith a shielding function exposed from the insulating resin portion. There can be provided a small-sized circuit module superior in an electromagnetic shielding function.


Find Patent Forward Citations

Hatanaka, Hidefumi. (2012). Circuit module and radio communications equipment, and method for manufacturing circuit module (U.S. Patent No. 8125788). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8125788

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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