The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Jun. 09, 2009
Kazuyoshi Maekawa, Tokyo, JP;
Kenichi Mori, Tokyo, JP;
Kazuyuki Omori, Tokyo, JP;
Yuki Koyama, Itami, JP;
Kazuyoshi Maekawa, Tokyo, JP;
Kenichi Mori, Tokyo, JP;
Kazuyuki Omori, Tokyo, JP;
Yuki Koyama, Itami, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device includes an interlayer film formed over a semiconductor substrate. A groove is formed in the interlayer film. A wiring formed in the groove is a copper alloy including copper and a metal element. An oxide layer of the metal element is formed over the surface of the wiring. The oxide layer is formed in a first region along a grain boundary of a copper crystal and a second region surrounded by the grain boundary, over the surface of the wiring. The oxide layer formed in the first region has a thickness greater than that of the oxide layer formed in the second region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile