The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Jun. 05, 2007
Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same
Tetsuo Ito, Osaka, JP;
Takayuki Yoshida, Shiga, JP;
Toshiyuki Fukuda, Kyoto, JP;
Takao Ochi, Shiga, JP;
Tetsuo Ito, Osaka, JP;
Takayuki Yoshida, Shiga, JP;
Toshiyuki Fukuda, Kyoto, JP;
Takao Ochi, Shiga, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A resin molding moldwith a cavityhas a resin injection portfrom which a molding resinis injected toward the cavity, and an air release portfrom which air from the cavityis released during resin injection. Not only the resin injection portbut also the air release portis formed in a top surface portionof the cavity. Thus, even if a resin burr remains in the resin injection portor the air release port, it can be prevented from adhering to an external terminalA provided on a front surface portionof the substrate