The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Jan. 09, 2008
Tadafumi Yoshida, Nisshin, JP;
Hiroshi Osada, Komaki, JP;
Yutaka Yokoi, Seto, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi-Ken, JP;
Abstract
A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR, such that the first semiconductor element is positioned upstream side than the second semiconductor element. A protruded portion for the second semiconductor element is provided to be positioned on the downstream side of first semiconductor element and upstream side than the center of second semiconductor element in the direction of arrow DR