The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Dec. 17, 2008
Stefan Kredler, Heuweiler, DE;
Reiner Bidenbach, Vörstetten, DE;
Jens Schubert, Freiburg, DE;
Klaus Heberle, Emmendingen, DE;
Stefan Kredler, Heuweiler, DE;
Reiner Bidenbach, Vörstetten, DE;
Jens Schubert, Freiburg, DE;
Klaus Heberle, Emmendingen, DE;
Micronas GmbH, Freiburg I.BR., DE;
Abstract
A semiconductor component has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.