The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2012

Filed:

Oct. 29, 2009
Applicants:

Kiyoto Ito, Kokubunji, JP;

Koji Hosogi, Hiratsuka, JP;

Takanobu Tsunoda, Kokubunji, JP;

Inventors:

Kiyoto Ito, Kokubunji, JP;

Koji Hosogi, Hiratsuka, JP;

Takanobu Tsunoda, Kokubunji, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
Abstract

A highly flexible semiconductor device of a stacked-type semiconductor device which transfers information by inductive coupling between inductors, in which LSI chips can be stacked even when a transmitter circuit and a receiver circuit are arranged at different positions from each other when viewed in a stacking direction. The semiconductor device has an interposer including a first inductor which is inductively coupled with a transmitter circuit of a first LSI chip to be stacked, and a second inductor which is inductively coupled with a receiver circuit of a second LSI chip to be stacked, the first inductor and the second inductor being electrically connected. An interchip communication is made from the first LSI chip to the second LSI chip.


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