The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Nov. 13, 2009
Jung-hwan Kim, Bucheon-si, KR;
Un-byoung Kang, Hwaseong-si, KR;
Dong-hun Yi, Asan-si, KR;
Woonseong Kwon, Seoul, KR;
Hyung-sun Jang, Suwon-si, KR;
Jongkeun Jeon, Cheonan-si, KR;
Yongjin Lee, Cheonan-si, KR;
Keeseok Kim, Cheonan-si, KR;
Jung-Hwan Kim, Bucheon-si, KR;
Un-Byoung Kang, Hwaseong-si, KR;
Dong-Hun Yi, Asan-si, KR;
Woonseong Kwon, Seoul, KR;
Hyung-Sun Jang, Suwon-si, KR;
Jongkeun Jeon, Cheonan-si, KR;
Yongjin Lee, Cheonan-si, KR;
Keeseok Kim, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.