The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2012

Filed:

Apr. 08, 2010
Applicants:

Tae Jun Kim, Gyunggi-do, KR;

Su Yeol Lee, Gyunggi-do, KR;

Dong Woo Kim, Seoul, KR;

Hyun Ju Park, Gyunggi-do, KR;

Hyoun Soo Shin, Seoul, KR;

IN Joon Pyeon, Gyunggi-do, KR;

Inventors:

Tae Jun Kim, Gyunggi-do, KR;

Su Yeol Lee, Gyunggi-do, KR;

Dong Woo Kim, Seoul, KR;

Hyun Ju Park, Gyunggi-do, KR;

Hyoun Soo Shin, Seoul, KR;

In Joon Pyeon, Gyunggi-do, KR;

Assignee:

Samsung Led Co., Ltd., Gyunggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.


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