The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
May. 07, 2007
Applicants:
Harry Hedler, Germering, DE;
Roland Irsigler, München, DE;
Volker Lehmann, München, DE;
Judith Lehmann, Legal Representative, München, DE;
Thorsten Meyer, Regensburg, DE;
Octavio Trovarelli, Dresden, DE;
Inventors:
Harry Hedler, Germering, DE;
Roland Irsigler, München, DE;
Volker Lehmann, München, DE;
Judith Lehmann, legal representative, München, DE;
Thorsten Meyer, Regensburg, DE;
Octavio Trovarelli, Dresden, DE;
Assignee:
Qimonda AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating an electrical contact through a through hole in a substrate, wherein the through hole is at least in part filled with a liquid conductive material and the solidified liquid conductive material provides an electrical contact through the through hole.