The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Dec. 09, 2009
Takashi Oda, Ibaraki, JP;
Shigenori Morita, Ibaraki, JP;
Naoko Yoshida, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki-shi, JP;
Abstract
A wiring circuit layerhaving a connecting conductor partthat can be connected to an electrodeof a semiconductor elementis formed on a metal support substratein a way such that the wiring circuit layer can be separated from the substrate, and that the connecting conductor partis exposed on the upper face of the wiring circuit layer. The wiring circuit layeris laminated on the elementwhile in a wafer state, and the connecting conductor partand the electrodeare connected. Subsequently, the support substrateis peeled from the wiring circuit layer, and the wafer is diced, whereby individual semiconductor devices are obtained.