The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2012

Filed:

Feb. 19, 2007
Applicants:

Masami Yanagida, Otsu, JP;

Kenji Ueshima, Kobe, JP;

Yuzuru Saito, Settsu, JP;

Inventors:

Masami Yanagida, Otsu, JP;

Kenji Ueshima, Kobe, JP;

Yuzuru Saito, Settsu, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); B29C 47/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

It is an object of the present invention to provide a method for manufacturing a multilayer polyimide film, uniform in film thickness and rate of dimensional change in the width direction of the film, which has a thermoplastic polyimide layer or the like serving as an adhesive layer. The object is attained by a method for manufacturing a multilayer polyimide film by width-spreading and flow-casting at least two types of polyimide resin solutions or polyimide precursor resin solutions fed into a multilayer coextrusion die including a plurality of flow channels, the method being characterized in that the thickness of each layer of the multilayer film is controlled by adding a solvent to the resin solutions to be fed into at least one of the flow channels and by adjusting, independently of the amounts of the resin solutions to be fed, the amount of the solvent to be added.


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