The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Oct. 23, 2008
Jae-chul Ryu, Seongnam-si, KR;
Jae-Chul Ryu, Seongnam-si, KR;
Samsung Techwin Co., Ltd., Changwon-si, KR;
Abstract
A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.