The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Aug. 04, 2009
Applicants:

Hayato Kondo, Yao, JP;

Kenji Maeda, Chiyoda-ku, JP;

Inventors:

Hayato Kondo, Yao, JP;

Kenji Maeda, Chiyoda-ku, JP;

Assignee:

Hosiden Corporation, Yao-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/00 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a high frequency circuit module according to the present invention includes: a circuit component having a plurality of terminals arranged on an outer side thereof, and a circuit board of a multilayered construction or a single-layered construction. A first outer face of the circuit board serves as a component mounting face for mounting the circuit component. The circuit board includes a ground conductor layer; a plurality of electrode pads provided on the component mounting face, the electrode pads being configured for connection with the associated terminals of the circuit component; and a plurality of waveguides provided on the first outer face or a second outer face, or in an inner portion of the circuit board. The waveguides are electrically connected with the associated electrode pads. Routing directions of all or some of adjacent waveguides are opposite from each other.


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