The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Jan. 24, 2011
Applicants:

Teruo Sasagawa, Los Gatos, CA (US);

Suryaprakash Ganti, Los Altos, CA (US);

Mark W. Miles, Atlanta, GA (US);

Clarence Chui, San Jose, CA (US);

Manish Kothari, Cupertino, CA (US);

Ming-hau Tung, San Francisco, CA (US);

Inventors:

Teruo Sasagawa, Los Gatos, CA (US);

SuryaPrakash Ganti, Los Altos, CA (US);

Mark W. Miles, Atlanta, GA (US);

Clarence Chui, San Jose, CA (US);

Manish Kothari, Cupertino, CA (US);

Ming-Hau Tung, San Francisco, CA (US);

Assignee:

QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.


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