The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8119919 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 21, 2012

Filed:

Oct. 22, 2007
Applicants:

Hiroyoshi Tagi, Osaka, JP;

Eiji Takahashi, Nara, JP;

Yoshiyuki Saito, Osaka, JP;

Inventors:

Hiroyoshi Tagi, Osaka, JP;

Eiji Takahashi, Nara, JP;

Yoshiyuki Saito, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a printed wiring board and a flexible printed wiring board which hardly generate radiation electromagnetic noises and are not easily affected by external noises. First and second wave-shape wirings are provided between at least two insulation substrates stacked on each other. The first and the second wave-shape wirings three-dimensionally intersect with each other in a plane direction and a thickness direction of the insulating substrates. The first and second wave-shape wirings are electrically separated from each other by a resist layer provided between the insulating substrates.


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Tagi, Hiroyoshi. (2012). Printed wiring board, method for manufacturing printed wiring board, and electric device (U.S. Patent No. 8119919). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8119919

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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