The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
May. 24, 2007
Dietrich Mund, Obersuessbach, DE;
Volker Seidemann, Berlin, DE;
Edgar Pawlowski, Stadecken-Elsheim, DE;
Ralf Biertuempfel, Mainz-Kastel, DE;
Bernd Woelfing, Mainz, DE;
Frank Fleissner, Mainz, DE;
Petra Auchter-krummel, Vendershein, DE;
Ulf Brauneck, Gross-Umstadt, DE;
Joseph S. Hayden, Clarks Summit, PA (US);
Ulrich Fotheringham, Wiesbaden, DE;
Dietrich Mund, Obersuessbach, DE;
Volker Seidemann, Berlin, DE;
Edgar Pawlowski, Stadecken-Elsheim, DE;
Ralf Biertuempfel, Mainz-Kastel, DE;
Bernd Woelfing, Mainz, DE;
Frank Fleissner, Mainz, DE;
Petra Auchter-Krummel, Vendershein, DE;
Ulf Brauneck, Gross-Umstadt, DE;
Joseph S. Hayden, Clarks Summit, PA (US);
Ulrich Fotheringham, Wiesbaden, DE;
Schott AG, Mainz, DE;
Abstract
The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.