The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Aug. 24, 2006
Takafumi Yao, Miyagi-ken, JP;
Meoung-whan Cho, Miyagi-ken, JP;
Takafumi Yao, Miyagi-ken, JP;
Meoung-Whan Cho, Miyagi-ken, JP;
Tohoku Techno Arch Co., Ltd., Sendai-shi, Miyagi-ken, JP;
Furukawa Co., Ltd., Tokyo, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Dowa Holdings Co., Ltd., Tokyo, JP;
Epivalley Co., Ltd., Gumi, Gyungsangbuk-do, KR;
Wavesquare Inc., Yongin, Gyeonggi-do, KR;
Abstract
A semiconductor substrate fabrication method according to the first aspect of this invention is characterized by including a preparation step of preparing an underlying substrate, a stacking step of stacking, on the underlying substrate, at least two multilayered films each including a peeling layer and a semiconductor layer, and a separation step of separating the semiconductor layer.