The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Oct. 20, 2009
Applicants:

James W. Adkisson, Jericho, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Mark D. Jaffe, Shelburne, VT (US);

Richard L. Rassel, Colchester, VT (US);

Inventors:

James W. Adkisson, Jericho, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Mark D. Jaffe, Shelburne, VT (US);

Richard L. Rassel, Colchester, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seat between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.


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