The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Feb. 14, 2008
Applicants:

Shivkumar Chiruvolu, San Jose, CA (US);

Vladimir K. Dioumaev, Mountain View, CA (US);

Nobuyuki Kambe, Menlo Park, CA (US);

Hui Du, Sunnyvale, CA (US);

Inventors:

Shivkumar Chiruvolu, San Jose, CA (US);

Vladimir K. Dioumaev, Mountain View, CA (US);

Nobuyuki Kambe, Menlo Park, CA (US);

Hui Du, Sunnyvale, CA (US);

Assignee:

NanoGram Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/02 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

Functional composite materials comprise elemental inorganic particles within an organic matrix. The elemental inorganic materials generally comprise elemental metal, elemental metalloid, alloys thereof, or mixtures thereof. In alternative or additional embodiments, the inorganic particles can comprise a metal oxide, a metalloid oxide, a combination thereof or a mixture thereof. The inorganic particles can have an average primary particle size of no more than abut 250 nm and a secondary particle size in a dispersion when blended with the organic matrix of no more than about 2 microns. The particles can be substantially unagglomerated within the composite. The organic binder can be a functional polymer such as a semiconducting polymer. The inorganic particles can be surface modified, such as with a moiety having an aromatic functional group for desirable interactions with a semiconducting polymer. Appropriate solution based methods can be used for forming the composite from dispersions of the particles. The composites can be processed into products, such as printed electronics devices.


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