The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Feb. 05, 2010
Applicants:

Dai Xin Peng, Suzhou, CN;

Zhuo Wang, Suzhou, CN;

Inventors:

Dai Xin Peng, Suzhou, CN;

Zhuo Wang, Suzhou, CN;

Assignee:

Ventec Electronics (Suzhou) Company Limited, New District, Sushou, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).


Find Patent Forward Citations

Peng, Dai. (2012). Copper clad laminate, prepreg and method of reducing signal loss (U.S. Patent No. 8119225). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8119225

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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