The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
May. 30, 2006
Robert L. Hise, Humble, TX (US);
Geoffrey E. Scanlon, Humble, TX (US);
Joseph Bergmeister, Iii, Kingwood, TX (US);
Daniel B. Knorr, Humble, TX (US);
Robert L. Hise, Humble, TX (US);
Geoffrey E. Scanlon, Humble, TX (US);
Joseph Bergmeister, III, Kingwood, TX (US);
Daniel B. Knorr, Humble, TX (US);
Chevron Phillips Chemical Company LP, The Woodlands, TX (US);
Abstract
A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer.