The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

May. 31, 2007
Applicants:

Weisheng Lei, Portland, OR (US);

Yunlong Sun, Beaverton, OR (US);

Yasu Osako, Lake Oswego, OR (US);

John Davignon, Hillsboro, OR (US);

Glenn Simenson, Portland, OR (US);

Hisashi Matsumoto, Hillsboro, OR (US);

Inventors:

Weisheng Lei, Portland, OR (US);

Yunlong Sun, Beaverton, OR (US);

Yasu Osako, Lake Oswego, OR (US);

John Davignon, Hillsboro, OR (US);

Glenn Simenson, Portland, OR (US);

Hisashi Matsumoto, Hillsboro, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/109 (2006.01); H01S 3/10 (2006.01); B23K 26/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.


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