The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2012

Filed:

Nov. 02, 2007
Applicants:

David G. Love, Pleasanton, CA (US);

Bidyut K. Sen, Milpitas, CA (US);

Inventors:

David G. Love, Pleasanton, CA (US);

Bidyut K. Sen, Milpitas, CA (US);

Assignee:

Oracle America, Inc., Redwood City, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate.


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